IDT71V65803S133BQGI
vs
71V65803S133BQ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
TBGA, BGA165,11X15,40
FBGA-165
Pin Count
165
165
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
4.2 ns
4.2 ns
Additional Feature
BURST COUNTER
PIPELINED ARCHITECTURE
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
e0
Length
15 mm
15 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX18
512KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.06 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.32 mA
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
13 mm
13 mm
Base Number Matches
1
3
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