IDT71V416YFS10BEI
vs
GS74116ATP-10T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
GSI TECHNOLOGY
Part Package Code
BGA
TSOP2
Package Description
9 X 9 MM, POWER, BGA-48
TSOP2, TSOP44,.46,32
Pin Count
48
44
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
kg CO2e/kg
12
Average Weight (mg)
141.6
CO2e (mg)
1699.2
Total Weight
156.8
Category CO2 Kg
12
12
CO2
1881.6000000000001
Compliance Temperature Grade
Industrial: -40C to +85C
Commercial: +0C to +70C
Candidate List Date
2024-01-23
2011-12-19
SVHC Over MCV
7439-92-1
CAS Accounted for Wt
67
CA Prop 65 Presence
YES
CA Prop 65 CAS Numbers
7439-92-1
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V4.01b
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B48
R-PDSO-G44
JESD-609 Code
e0
e0
Length
9 mm
18.41 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
4
3
Number of Functions
1
1
Number of Terminals
48
44
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
256KX16
256KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TSOP2
Package Equivalence Code
BGA48,6X8,30
TSOP44,.46,32
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.02 A
0.01 A
Standby Voltage-Min
3 V
3 V
Supply Current-Max
0.2 mA
0.105 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
9 mm
10.16 mm
Base Number Matches
1
1
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