IDT71V3576S200BG8
vs
MT58L128V36PB-5
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA-119
14 X 22 MM, BGA-119
Pin Count
119
119
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.1 ns
3.1 ns
Additional Feature
ALSO REQUIRES 3.3V I/O SUPPLY
AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e3
e0
Length
22 mm
22 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
36
36
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX36
128KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
2.4 mm
Supply Voltage-Max (Vsup)
3.465 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.525 mA
Compare IDT71V3576S200BG8 with alternatives
Compare MT58L128V36PB-5 with alternatives