IDT71V3556XS133PFGI8
vs
71V546S133PFI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFP, QFP100,.63X.87
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.2 ns
4.2 ns
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e3
e0
Memory Density
4718592 bit
4718592 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Terminals
100
100
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Equivalence Code
QFP100,.63X.87
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.045 A
0.045 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.31 mA
0.31 mA
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
20
Base Number Matches
1
1
Compare IDT71V3556XS133PFGI8 with alternatives
Compare 71V546S133PFI8 with alternatives