IDT71V3556S100PF9
vs
CY7C1350G-250AXI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
LQFP,
LQFP, QFP100,.63X.87
Pin Count
100
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
2.6 ns
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
e3
Length
20 mm
20 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
128KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
14 mm
14 mm
Base Number Matches
1
1
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63X.87
Standby Current-Max
0.04 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.325 mA
Compare IDT71V3556S100PF9 with alternatives
Compare CY7C1350G-250AXI with alternatives