IDT71V30S35TFG8 vs IDT71V30S35TF8 feature comparison

IDT71V30S35TFG8 Integrated Device Technology Inc

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IDT71V30S35TF8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Ports 2 2
Number of Terminals 64 64
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX8 1KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Equivalence Code QFP64,.47SQ,20 QFP64,.47SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A 0.005 A
Standby Voltage-Min 3 V 3 V
Supply Current-Max 0.145 mA 0.145 mA
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1
Part Package Code QFP
Package Description STQFP-64
Pin Count 64
Length 10 mm
Number of Functions 1
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Width 10 mm

Compare IDT71V30S35TFG8 with alternatives

Compare IDT71V30S35TF8 with alternatives