IDT71V30L25TF
vs
IDT7130LA25CGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
DIP
Package Description
STQFP-64
DIP, DIP48,.6
Pin Count
64
48
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
Additional Feature
BATTERY BACKUP OPERATION
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQFP-G64
R-CDIP-T48
JESD-609 Code
e0
e3
Length
10 mm
60.96 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
64
48
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1KX8
1KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
LFQFP
DIP
Package Equivalence Code
QFP64,.47SQ,20
DIP48,.6
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
4.826 mm
Standby Current-Max
0.003 A
0.004 A
Standby Voltage-Min
3 V
2 V
Supply Current-Max
0.12 mA
0.22 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
15.24 mm
Base Number Matches
5
2
Compare IDT71V30L25TF with alternatives
Compare IDT7130LA25CGI with alternatives