IDT71V2546XS133PF vs IS61DDPB21M18A-550B4I feature comparison

IDT71V2546XS133PF Integrated Device Technology Inc

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IS61DDPB21M18A-550B4I Integrated Silicon Solution Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED SILICON SOLUTION INC
Part Package Code QFP BGA
Package Description LQFP, LBGA,
Pin Count 100 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4.2 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PQFP-G100 R-PBGA-B165
JESD-609 Code e0
Length 20 mm 15 mm
Memory Density 4718592 bit 18874368 bit
Memory IC Type ZBT SRAM DDR SRAM
Memory Width 36 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 165
Number of Words 131072 words 1048576 words
Number of Words Code 128000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX36 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.6 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.465 V 1.89 V
Supply Voltage-Min (Vsup) 3.135 V 1.71 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 13 mm
Base Number Matches 1 1

Compare IDT71V2546XS133PF with alternatives

Compare IS61DDPB21M18A-550B4I with alternatives