IDT71V016SA10BF8
vs
CY7C1021DV33-10BAXC
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA, BGA48,6X8,30
|
7 X 7 MM, 1.20 MM, LEAD FREE, FBGA-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.B
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Date Of Intro |
1996-08-01
|
|
| Access Time-Max |
10 ns
|
10 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PBGA-B48
|
S-PBGA-B48
|
| JESD-609 Code |
e0
|
e1
|
| Length |
7 mm
|
7 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
64KX16
|
64KX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA48,6X8,30
|
BGA48,6X8,30
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.34 mm
|
1.2 mm
|
| Standby Current-Max |
0.01 A
|
0.003 A
|
| Standby Voltage-Min |
3.15 V
|
3 V
|
| Supply Current-Max |
0.16 mA
|
0.06 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
2.97 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.75 mm
|
0.75 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare IDT71V016SA10BF8 with alternatives
Compare CY7C1021DV33-10BAXC with alternatives