IDT71T65602S133PF vs TC55VD836FF-133 feature comparison

IDT71T65602S133PF Integrated Device Technology Inc

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TC55VD836FF-133 Toshiba America Electronic Components

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TOSHIBA CORP
Part Package Code QFP QFP
Package Description LQFP, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100
Pin Count 100 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 4.2 ns 4.2 ns
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX36 256KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.7 mm
Supply Voltage-Max (Vsup) 2.625 V 3.465 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 1

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Compare TC55VD836FF-133 with alternatives