IDT7188L55DBG
vs
5962-8685919YA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
CDIP
Package Description
0.300 INCH, CERAMIC, DIP-22
DIP, DIP22,.3
Pin Count
22
22
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
JESD-30 Code
R-GDIP-T22
R-CDIP-T22
JESD-609 Code
e3
e0
Length
27.051 mm
27.555 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
OTHER SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
22
22
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
16KX4
16KX4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Standby Voltage-Min
2 V
2 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
3
Manufacturer Package Code
CD22
I/O Type
COMMON
Moisture Sensitivity Level
1
Package Equivalence Code
DIP22,.3
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.001 A
Supply Current-Max
0.09 mA
Compare IDT7188L55DBG with alternatives
Compare 5962-8685919YA with alternatives