IDT71681LA70EB vs MCM62351P25 feature comparison

IDT71681LA70EB Integrated Device Technology Inc

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MCM62351P25 Freescale Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DFP
Package Description 0.300 INCH, CERPACK-24 DIP, DIP24,.3
Pin Count 24
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 70 ns 25 ns
I/O Type SEPARATE
JESD-30 Code R-GDFP-F24 R-PDIP-T24
JESD-609 Code e0 e0
Length 15.748 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM CACHE TAG SRAM
Memory Width 4 4
Number of Functions 1
Number of Ports 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 4KX4 4KX4
Output Characteristics 3-STATE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP DIP
Package Equivalence Code FL24,.4 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 2.286 mm
Standby Current-Max 0.0001 A 0.14 A
Standby Voltage-Min 2 V
Supply Current-Max 0.08 mA 0.14 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 9.144 mm
Base Number Matches 1 3
Power Supplies 5 V

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