IDT7143SA70JB
vs
IDT7143SA55PFGI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
QFP
Package Description
QCCJ, LDCC68,1.0SQ
LFQFP,
Pin Count
68
100
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
55 ns
I/O Type
COMMON
JESD-30 Code
S-PQCC-J68
S-PQFP-G100
JESD-609 Code
e0
e3
Length
24.2062 mm
14 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
68
100
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
2KX16
2KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
LFQFP
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Seated Height-Max
4.572 mm
1.6 mm
Standby Current-Max
0.004 A
Standby Voltage-Min
2 V
Supply Current-Max
0.31 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
24.2062 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Compare IDT7143SA70JB with alternatives
Compare IDT7143SA55PFGI with alternatives