IDT7143SA55PFG vs 7143LA70J feature comparison

IDT7143SA55PFG Integrated Device Technology Inc

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7143LA70J Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP LCC
Package Description LFQFP, QCCJ, LDCC68,1.0SQ
Pin Count 100 68
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 70 ns
JESD-30 Code S-PQFP-G100 S-PQCC-J68
JESD-609 Code e3 e0
Length 14 mm 24.2062 mm
Memory Density 32768 bit 32768 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 100 68
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX16 2KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QCCJ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 4.572 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 14 mm 24.2062 mm
Base Number Matches 1 1
I/O Type COMMON
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code LDCC68,1.0SQ
Standby Current-Max 0.0015 A
Standby Voltage-Min 2 V
Supply Current-Max 0.25 mA

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