IDT7143LA45PFGB vs IDT7143LA55JGI feature comparison

IDT7143LA45PFGB Integrated Device Technology Inc

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IDT7143LA55JGI Integrated Device Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP LCC
Package Description LFQFP, QCCJ,
Pin Count 100 68
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 55 ns
JESD-30 Code S-PQFP-G100 S-PQCC-J68
JESD-609 Code e3 e3
Length 14 mm 24.2062 mm
Memory Density 32768 bit 32768 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 68
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 2KX16 2KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QCCJ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 1.6 mm 4.572 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Matte Tin (Sn) MATTE TIN
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 24.2062 mm
Base Number Matches 1 1

Compare IDT7143LA45PFGB with alternatives

Compare IDT7143LA55JGI with alternatives