IDT71421SA55JI8
vs
CY7C136-55NCT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
LCC
QFP
Package Description
0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
QFP,
Pin Count
52
52
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
Additional Feature
INTERRUPT FLAG; AUTOMATIC POWER-DOWN
AUTOMATIC POWER-DOWN; INTERRUPT FLAG
I/O Type
COMMON
JESD-30 Code
S-PQCC-J52
S-PQFP-G52
JESD-609 Code
e0
e0
Length
19.1262 mm
10 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
52
52
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QFP
Package Equivalence Code
LDCC52,.8SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
2.45 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.19 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
19.1262 mm
10 mm
Base Number Matches
1
1
Output Enable
YES
Compare IDT71421SA55JI8 with alternatives
Compare CY7C136-55NCT with alternatives