IDT7140LA25TF
vs
7140LA25LG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
LFQFP, QFP64,.47SQ,20
QCCN,
Pin Count
64
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
JESD-30 Code
S-PQFP-G64
S-XQCC-N48
JESD-609 Code
e0
Length
10 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
MULTI-PORT SRAM
DUAL-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
64
48
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1KX8
1KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
LFQFP
QCCN
Package Equivalence Code
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.0015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.17 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
Base Number Matches
12
1
Compare IDT7140LA25TF with alternatives
Compare 7140LA25LG8 with alternatives