IDT7140LA25FGB8
vs
7140SA25F8
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
QFF, QFL48,.75SQ
|
QFF, QFL48,.75SQ
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
25 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-XQFP-F48
|
S-XQFP-F48
|
JESD-609 Code |
e3
|
e0
|
Memory Density |
8192 bit
|
8192 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
8
|
8
|
Number of Ports |
2
|
2
|
Number of Terminals |
48
|
48
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
1KX8
|
1KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
QFF
|
QFF
|
Package Equivalence Code |
QFL48,.75SQ
|
QFL48,.75SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Standby Current-Max |
0.004 A
|
0.015 A
|
Standby Voltage-Min |
2 V
|
4.5 V
|
Supply Current-Max |
0.22 mA
|
0.22 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
1
|
2
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare IDT7140LA25FGB8 with alternatives
Compare 7140SA25F8 with alternatives