IDT71321LA55TFG vs IDT71321LA55TF9 feature comparison

IDT71321LA55TFG Integrated Device Technology Inc

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IDT71321LA55TF9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description LFQFP, QFP64,.47SQ,20 TFQFP,
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 1988-01-01
Access Time-Max 55 ns 55 ns
Additional Feature AUTOMATIC POWER DOWN INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP
I/O Type COMMON
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Length 10 mm 10 mm
Memory Density 16384 bit 16384 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 64 64
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX8 2KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP TFQFP
Package Equivalence Code QFP64,.47SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.2 mm
Standby Current-Max 0.0015 A
Standby Voltage-Min 2 V
Supply Current-Max 0.11 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 10 mm
Base Number Matches 1 1

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