IDT7130SA55TFB
vs
7130LA55J
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
PLCC
|
| Package Description |
LFQFP, QFL48,.75SQ
|
PLASTIC, LCC-52
|
| Pin Count |
64
|
52
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
55 ns
|
55 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQCC-J52
|
| JESD-609 Code |
e0
|
e0
|
| Length |
10 mm
|
19.1262 mm
|
| Memory Density |
8192 bit
|
8192 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
64
|
52
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
1KX8
|
1KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
QCCJ
|
| Package Equivalence Code |
QFL48,.75SQ
|
LDCC52,.8SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535
|
|
| Seated Height-Max |
1.6 mm
|
4.57 mm
|
| Standby Current-Max |
0.015 A
|
0.0015 A
|
| Standby Voltage-Min |
4.5 V
|
2 V
|
| Supply Current-Max |
0.19 mA
|
0.11 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
19.1262 mm
|
| Base Number Matches |
2
|
24
|
| Manufacturer Package Code |
|
PL52
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare IDT7130SA55TFB with alternatives
Compare 7130LA55J with alternatives