IDT7130LA55PFGI8 vs 7130LA55J feature comparison

IDT7130LA55PFGI8 Integrated Device Technology Inc

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7130LA55J Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQFP-G64 S-PQCC-J52
JESD-609 Code e3 e0
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Ports 2 2
Number of Terminals 64 52
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1KX8 1KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QCCJ
Package Equivalence Code QFP64,.66SQ,32 LDCC52,.8SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.004 A 0.0015 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.14 mA 0.11 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 20
Base Number Matches 1 24
Part Package Code PLCC
Package Description PLASTIC, LCC-52
Pin Count 52
Manufacturer Package Code PL52
Length 19.1262 mm
Number of Functions 1
Seated Height-Max 4.57 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 19.1262 mm

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