IDT7130LA100P vs IDT7130LA100PF9 feature comparison

IDT7130LA100P Integrated Device Technology Inc

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IDT7130LA100PF9 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP QFP
Package Description PLASTIC, DIP-48 TQFP-64
Pin Count 48 64
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 100 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T48 S-PQFP-G64
JESD-609 Code e0 e0
Length 61.849 mm 14 mm
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 2
Number of Terminals 48 64
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX8 1KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP LQFP
Package Equivalence Code DIP48,.6
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.6 mm
Standby Current-Max 0.004 A
Standby Voltage-Min 2 V
Supply Current-Max 0.11 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 15.24 mm 14 mm
Base Number Matches 26 1
Moisture Sensitivity Level 3

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