IDT70V9379L7PRFI
vs
70V9379L7PRFI9
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
TQFP
|
| Package Description |
TQFP-128
|
,
|
| Pin Count |
128
|
128
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.B.2.B
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
7.5 ns
|
|
| Additional Feature |
PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE
|
|
| JESD-30 Code |
R-PQFP-G128
|
|
| JESD-609 Code |
e0
|
e0
|
| Length |
20 mm
|
|
| Memory Density |
589824 bit
|
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
18
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
|
| Number of Terminals |
128
|
|
| Number of Words |
32768 words
|
|
| Number of Words Code |
32000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
32KX18
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFQFP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
225
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
PK128
|
|
|
|
Compare IDT70V9379L7PRFI with alternatives
Compare 70V9379L7PRFI9 with alternatives