IDT70V9269S9PRF9 vs IDT70V9269S9PRFG8 feature comparison

IDT70V9269S9PRF9 Integrated Device Technology Inc

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IDT70V9269S9PRFG8 Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description 14 X 20 MM, 1.40 MM HEIGHT, TQFP-128 LFQFP,
Pin Count 128 128
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code R-PQFP-G128 R-PQFP-G128
JESD-609 Code e0 e3
Length 20 mm 20 mm
Memory Density 262144 bit 262144 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 128 128
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 16KX16 16KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 1

Compare IDT70V9269S9PRF9 with alternatives

Compare IDT70V9269S9PRFG8 with alternatives