IDT70V9269L12PRF
vs
70V9269L12PRFGI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
TQFP
Package Description
14 X 20 MM, 1.40 MM HEIGHT, TQFP-128
Pin Count
128
128
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
50 MHz
I/O Type
COMMON
JESD-30 Code
R-PQFP-G128
JESD-609 Code
e0
e3
Length
20 mm
Memory Density
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Ports
2
Number of Terminals
128
Number of Words
16384 words
Number of Words Code
16000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
16KX16
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
Package Code
LFQFP
Package Equivalence Code
QFP128,.63X.87
Package Shape
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.003 A
Standby Voltage-Min
3 V
Supply Current-Max
0.205 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
TIN
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
14 mm
Base Number Matches
1
2
Manufacturer Package Code
PKG128
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