IDT70V9089S12PF9 vs 70V9089S12PFGI8 feature comparison

IDT70V9089S12PF9 Integrated Device Technology Inc

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70V9089S12PFGI8 Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP
Package Description LFQFP, QFP,
Pin Count 100
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 12 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e0
Length 14 mm
Memory Density 524288 bit 524288 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 100 100
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64KX8 64KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm
Base Number Matches 1 1

Compare IDT70V9089S12PF9 with alternatives

Compare 70V9089S12PFGI8 with alternatives