IDT70V9089L12PFGI
vs
IDT70V9089L12PFI8
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP,
|
LFQFP,
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
|
| Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
|
| JESD-30 Code |
S-PQFP-G100
|
|
| JESD-609 Code |
e3
|
|
| Length |
14 mm
|
|
| Memory Density |
524288 bit
|
|
| Memory IC Type |
MULTI-PORT SRAM
|
|
| Memory Width |
8
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
100
|
|
| Number of Words |
65536 words
|
|
| Number of Words Code |
64000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
64KX8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFQFP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare IDT70V9089L12PFGI with alternatives
Compare IDT70V9089L12PFI8 with alternatives