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IDT70V7599S166BCI vs 70V7599S166BC feature comparison

IDT70V7599S166BCI Integrated Device Technology Inc

Buy Now Datasheet

70V7599S166BC Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA CABGA
Package Description 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
kg CO2e/kg 12 12
Average Weight (mg) 914.1 914.1
CO2e (mg) 10969.2 10969.2
Total Weight 914.6 914.6
Category CO2 Kg 12 12
CO2 10975.2 10975.2
Compliance Temperature Grade Industrial: -40C to +85C Commercial: +0C to +70C
Candidate List Date 2024-01-23 2024-01-23
SVHC Over MCV 7439-92-1 7439-92-1
CAS Accounted for Wt 71 71
CA Prop 65 Presence YES YES
CA Prop 65 CAS Numbers 7439-92-1 7439-92-1
Conflict Mineral Status DRC Conflict Free Undeterminable DRC Conflict Free
Conflict Mineral Status Source CMRT V2.03a CMRT V6.01
Access Time-Max 12 ns 12 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 166 MHz 166 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 256 256
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX36 128KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Standby Current-Max 0.04 A 0.03 A
Standby Voltage-Min 3.15 V 3.15 V
Supply Current-Max 0.83 mA 0.79 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 17 mm 17 mm
Base Number Matches 1 2
Manufacturer Package Code BC256
Memory » SRAMs
Memory » SRAMs

Compare IDT70V7599S166BCI with alternatives

Compare 70V7599S166BC with alternatives