IDT70V7599S133BFI
vs
70V7599S133BFI
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
CABGA
Package Description
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208
Pin Count
208
208
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
Additional Feature
PIPELINED OR FLOW-THROUGH ARCHITECTURE
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B208
S-PBGA-B208
JESD-609 Code
e0
e0
Length
15 mm
15 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
208
208
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA208,17X17,32
BGA208,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Standby Current-Max
0.04 A
0.04 A
Standby Voltage-Min
3.15 V
3.15 V
Supply Current-Max
0.675 mA
0.675 mA
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
20
Width
15 mm
15 mm
Base Number Matches
1
1
Manufacturer Package Code
BF208
Compare IDT70V7599S133BFI with alternatives
Compare 70V7599S133BFI with alternatives