IDT70V7589S133BCGI8
vs
70V7589S200BC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
CABGA
Package Description
BGA-256
Pin Count
256
256
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.A
3A991
HTS Code
8542.32.00.41
8542320040
Access Time-Max
15 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e1
Length
17 mm
Memory Density
2359296 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
256
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
64KX36
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Supply Voltage-Max (Vsup)
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Base Number Matches
1
2
Manufacturer Package Code
BC256
Samacsys Manufacturer
Renesas Electronics
Compare IDT70V7589S133BCGI8 with alternatives