IDT70V659S10BF
vs
70T659S10BFGI8
feature comparison
All Stats
Differences Only
Pbfree Code
No
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
Package Description
TFBGA, BGA208,17X17,32
FBGA-208
Pin Count
208
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B208
S-PBGA-B208
JESD-609 Code
e0
e1
Length
15 mm
15 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
MULTI-PORT SRAM
APPLICATION SPECIFIC SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
208
208
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA208,17X17,32
BGA208,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.015 A
0.02 A
Standby Voltage-Min
3.15 V
2.4 V
Supply Current-Max
0.5 mA
0.445 mA
Supply Voltage-Max (Vsup)
3.45 V
2.6 V
Supply Voltage-Min (Vsup)
3.15 V
2.4 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
15 mm
15 mm
Base Number Matches
1
1
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