IDT70V639S15BCGI
vs
IDT70V639S15BCI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
Pin Count
256
256
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
17 mm
17 mm
Memory Density
2359296 bit
2359296 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
256
256
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX18
128KX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.5 mm
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
1
1
I/O Type
COMMON
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA256,16X16,40
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.015 A
Standby Voltage-Min
3.15 V
Supply Current-Max
0.49 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare IDT70V639S15BCGI with alternatives
Compare IDT70V639S15BCI with alternatives