IDT70V5388S166BGGI
vs
70V5388S166BGI8
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
PBGA
|
| Package Description |
27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, GREEN, BGA-272
|
27 X 27 MM, 1.27 MM PITCH, BGA-272
|
| Pin Count |
272
|
272
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
3.2 ns
|
3.2 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
166 MHz
|
166 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
| JESD-609 Code |
e3
|
e0
|
| Length |
27 mm
|
27 mm
|
| Memory Density |
1179648 bit
|
1179648 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Ports |
4
|
4
|
| Number of Terminals |
272
|
272
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
64KX18
|
64KX18
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA272,20X20,50
|
BGA272,20X20,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.54 mm
|
2.54 mm
|
| Standby Current-Max |
0.015 A
|
0.015 A
|
| Standby Voltage-Min |
3.15 V
|
3.15 V
|
| Supply Current-Max |
0.4 mA
|
0.4 mA
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
BG272
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare IDT70V5388S166BGGI with alternatives
Compare 70V5388S166BGI8 with alternatives