IDT70V3579S5BCGI
vs
70V3579S5DRGI8
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA, BGA256,16X16,40
|
FQFP,
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Date Of Intro |
1998-12-01
|
|
| Access Time-Max |
5 ns
|
5 ns
|
| Additional Feature |
PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE
|
PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE
|
| Clock Frequency-Max (fCLK) |
100 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G208
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
28 mm
|
| Memory Density |
1179648 bit
|
1179648 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
DUAL-PORT SRAM
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
256
|
208
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
32KX36
|
32KX36
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
FQFP
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.7 mm
|
4.1 mm
|
| Standby Voltage-Min |
3.15 V
|
|
| Supply Current-Max |
0.415 mA
|
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
17 mm
|
28 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare IDT70V3579S5BCGI with alternatives
Compare 70V3579S5DRGI8 with alternatives