IDT70V3569S6BCGI vs 70V3569S6BFGI feature comparison

IDT70V3569S6BCGI Integrated Device Technology Inc

Buy Now Datasheet

70V3569S6BFGI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description LBGA, TFBGA,
Pin Count 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6 ns 6 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B208
JESD-609 Code e1 e1
Length 17 mm 15 mm
Memory Density 589824 bit 589824 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 256 208
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16KX36 16KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 15 mm
Base Number Matches 1 2
Additional Feature PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE

Compare IDT70V3569S6BCGI with alternatives

Compare 70V3569S6BFGI with alternatives