IDT70V3569S5DRI8
vs
70V3569S4DRG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
PLASTIC, QFP-208
FQFP,
Pin Count
208
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
4.2 ns
Additional Feature
PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE
PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
JESD-609 Code
e0
e3
Length
28 mm
28 mm
Memory Density
589824 bit
589824 bit
Memory IC Type
MULTI-PORT SRAM
DUAL-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
208
208
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
16KX36
16KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
4.1 mm
4.1 mm
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
28 mm
28 mm
Base Number Matches
1
1
Compare IDT70V3569S5DRI8 with alternatives
Compare 70V3569S4DRG8 with alternatives