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IDT70V3569S5BFGI8 vs 70V3569S5BFI feature comparison

IDT70V3569S5BFGI8 Integrated Device Technology Inc

Buy Now Datasheet

70V3569S5BFI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA CABGA
Package Description TFBGA, BGA208,17X17,32 FINE PITCH, BGA-208
Pin Count 208 208
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 5 ns 5 ns
Additional Feature PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE
Clock Frequency-Max (fCLK) 100 MHz 100 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e1 e0
Length 15 mm 15 mm
Memory Density 589824 bit 589824 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 208
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16KX36 16KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA208,17X17,32 BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.03 A 0.03 A
Standby Voltage-Min 3.15 V 3.15 V
Supply Current-Max 0.415 mA 0.415 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 15 mm 15 mm
Base Number Matches 1 2
Manufacturer Package Code BF208
Date Of Intro 1999-01-01
Memory » SRAMs
Memory » SRAMs

Compare IDT70V3569S5BFGI8 with alternatives

Compare 70V3569S5BFI with alternatives