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IDT70V3389S5BFI8 vs IDT70V3389S5BFGI8 feature comparison

IDT70V3389S5BFI8 Integrated Device Technology Inc

Buy Now Datasheet

IDT70V3389S5BFGI8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TFBGA, BGA208,17X17,32 TFBGA, BGA208,17X17,32
Pin Count 208 208
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 1999-01-01
Total Weight 539.4 539.4
Category CO2 Kg 12 12
CO2 6472.799999999999 6472.799999999999
Compliance Temperature Grade Industrial: -40C to +85C Industrial: -40C to +85C
Candidate List Date 2024-01-23 2020-01-16
SVHC Over MCV 7439-92-1
CAS Accounted for Wt 78 78
CA Prop 65 Presence YES YES
CA Prop 65 CAS Numbers 1333-86-4, 7439-92-1, 7440-02-0 1333-86-4, 7440-02-0
Conflict Mineral Status DRC Conflict Free DRC Conflict Free
Conflict Mineral Status Source CMRT V6.01 CMRT V6.01
Access Time-Max 5 ns 5 ns
Additional Feature PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE
Clock Frequency-Max (fCLK) 100 MHz 100 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e0 e1
Length 15 mm 15 mm
Memory Density 1179648 bit 1179648 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 208
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX18 64KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA208,17X17,32 BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.03 A 0.03 A
Standby Voltage-Min 3.15 V 3.15 V
Supply Current-Max 0.415 mA 0.415 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 30
Width 15 mm 15 mm
Base Number Matches 1 1
EU RoHS Version RoHS 2 (2015/863/EU)
EFUP e
Memory » SRAMs
Memory » SRAMs

Compare IDT70V3389S5BFI8 with alternatives

Compare IDT70V3389S5BFGI8 with alternatives