IDT70V25L20PF9 vs IDT70V25TS20PF8 feature comparison

IDT70V25L20PF9 Integrated Device Technology Inc

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IDT70V25TS20PF8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Pin Count 100
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e0 e0
Length 14 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1
Number of Terminals 100 100
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 14 mm
Base Number Matches 1 1
I/O Type COMMON
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63SQ,20
Standby Current-Max 0.005 A
Standby Voltage-Min 3 V
Supply Current-Max 0.2 mA

Compare IDT70V25L20PF9 with alternatives

Compare IDT70V25TS20PF8 with alternatives