IDT70V25L20J vs 70V25S20PFG8 feature comparison

IDT70V25L20J Integrated Device Technology Inc

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70V25S20PFG8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC
Package Description 1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84 TQFP-100
Pin Count 84
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
I/O Type COMMON
JESD-30 Code S-PQCC-J84 S-PQFP-G100
JESD-609 Code e0
Length 29.3116 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Ports 2
Number of Terminals 84 100
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX16 8KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QFP
Package Equivalence Code LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 4.572 mm
Standby Current-Max 0.0025 A
Standby Voltage-Min 3 V
Supply Current-Max 0.175 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form J BEND GULL WING
Terminal Pitch 2.54 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 29.3116 mm
Base Number Matches 6 1

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Compare 70V25S20PFG8 with alternatives