IDT70V24TL20JI8 vs IDT70V24TL20J8 feature comparison

IDT70V24TL20JI8 Integrated Device Technology Inc

Buy Now Datasheet

IDT70V24TL20J8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
I/O Type COMMON COMMON
JESD-30 Code S-XQCC-J84 S-XQCC-J84
JESD-609 Code e0 e0
Memory Density 65536 bit 65536 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 1 1
Number of Ports 2 2
Number of Terminals 84 84
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4KX16 4KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC CERAMIC
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0025 A 0.0025 A
Standby Voltage-Min 3 V 3 V
Supply Current-Max 0.195 mA 0.175 mA
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1

Compare IDT70V24TL20JI8 with alternatives

Compare IDT70V24TL20J8 with alternatives