IDT70V19L20PF
vs
MT58L32L32DT-7.5IT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
TQFP-100
LQFP,
Pin Count
100
100
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
4.2 ns
I/O Type
COMMON
JESD-30 Code
S-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
Length
14 mm
20 mm
Memory Density
1179648 bit
1048576 bit
Memory IC Type
MULTI-PORT SRAM
CACHE SRAM
Memory Width
9
32
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
100
100
Number of Words
131072 words
32768 words
Number of Words Code
128000
32000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX9
32KX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LQFP
Package Equivalence Code
QFP100,.63SQ,20
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.003 A
Standby Voltage-Min
3 V
Supply Current-Max
0.205 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
14 mm
Base Number Matches
1
2
Compare IDT70V19L20PF with alternatives
Compare MT58L32L32DT-7.5IT with alternatives