IDT70V07S25JG
vs
IDT7007S25PFI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
QFP
Package Description
QCCJ,
14 X 14 MM, 1.40 MM HEIGHT, TQFP-80
Pin Count
68
80
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
Additional Feature
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-30 Code
S-PQCC-J68
S-PQFP-G80
JESD-609 Code
e3
e0
Length
24.2062 mm
14 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
68
80
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
LQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
24.2062 mm
14 mm
Base Number Matches
2
2
I/O Type
COMMON
Moisture Sensitivity Level
3
Package Equivalence Code
QFP80,.64SQ
Peak Reflow Temperature (Cel)
240
Standby Current-Max
0.03 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.345 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare IDT70V07S25JG with alternatives
Compare IDT7007S25PFI with alternatives