IDT70V07L25PFGI
vs
7007L25JB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
LCC
Package Description
LQFP,
QCCJ, LDCC68,1.0SQ
Pin Count
80
68
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
S-PQFP-G80
S-PQCC-J68
JESD-609 Code
e3
e0
Length
14 mm
24.2062 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
80
68
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
4.572 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
14 mm
24.2062 mm
Base Number Matches
2
4
I/O Type
COMMON
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
LDCC68,1.0SQ
Screening Level
MIL-PRF-38535
Standby Current-Max
0.01 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.305 mA
Compare IDT70V07L25PFGI with alternatives
Compare 7007L25JB with alternatives