IDT70V06S55PF9 vs 5962-8866509ZA feature comparison

IDT70V06S55PF9 Integrated Device Technology Inc

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5962-8866509ZA Defense Logistics Agency

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC DEFENSE LOGISTICS AGENCY
Part Package Code QFP
Package Description TQFP-64 CAVITY-UP, CERAMIC, PGA-68
Pin Count 64
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns 70 ns
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN ARBITER
JESD-30 Code S-PQFP-G64
JESD-609 Code e0 e0
Length 14 mm 29.464 mm
Memory Density 131072 bit 32768 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 64
Number of Words 16384 words 2048 words
Number of Words Code 16000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX8 2KX16
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LQFP PGA
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Qualified
Seated Height-Max 1.6 mm 5.207 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING PIN/PEG
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 14 mm 29.464 mm
Base Number Matches 1 1

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Compare 5962-8866509ZA with alternatives