IDT70V05L55JGI vs IDT7005L55JI8 feature comparison

IDT70V05L55JGI Integrated Device Technology Inc

Buy Now Datasheet

IDT7005L55JI8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC LCC
Package Description QCCJ, 0.950 X 0.950 INCH, 0.120 INCH HEIGHT, PLASTIC, LCC-68
Pin Count 68 68
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e3 e0
Length 24.2062 mm 24.2062 mm
Memory Density 65536 bit 65536 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.572 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 24.2062 mm 24.2062 mm
Base Number Matches 1 1
Additional Feature SEMAPHORE; AUTOMATIC POWER DOWN
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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Compare IDT7005L55JI8 with alternatives