IDT70T651S10BFI
vs
AS9C25256M2036L-166PI
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED SILICON SOLUTION INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
LFBGA, BGA208,17X17,32
|
FQFP,
|
| Pin Count |
208
|
208
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
10 ns
|
10 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-PBGA-B208
|
S-PQFP-G208
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15 mm
|
28 mm
|
| Memory Density |
9437184 bit
|
9437184 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
208
|
208
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256KX36
|
256KX36
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
FQFP
|
| Package Equivalence Code |
BGA208,17X17,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.5 mm
|
|
| Standby Current-Max |
0.02 A
|
|
| Standby Voltage-Min |
2.4 V
|
|
| Supply Current-Max |
0.445 mA
|
|
| Supply Voltage-Max (Vsup) |
2.6 V
|
2.6 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
15 mm
|
28 mm
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
|
|
|
Compare IDT70T651S10BFI with alternatives
Compare AS9C25256M2036L-166PI with alternatives