IDT70T651S10BC8
vs
70T651S10BCG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
Package Description
LBGA, BGA256,16X16,40
BGA, BGA256,16X16,40
Pin Count
256
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
256
256
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX36
256KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
Standby Current-Max
0.01 A
0.01 A
Standby Voltage-Min
2.4 V
2.4 V
Supply Current-Max
0.405 mA
0.405 mA
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
17 mm
Base Number Matches
1
1
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