IDT70T633S10DD
vs
AS9C25512M2018L-166TI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
LFQFP,
Pin Count
144
144
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
JESD-30 Code
S-PQFP-G144
S-PQFP-G144
JESD-609 Code
e0
e0
Length
20 mm
20 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
18
Moisture Sensitivity Level
4
Number of Functions
1
1
Number of Ports
2
Number of Terminals
144
144
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX18
512KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.405 mA
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
20 mm
20 mm
Base Number Matches
1
2
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Compare IDT70T633S10DD with alternatives
Compare AS9C25512M2018L-166TI with alternatives