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IDT70T3599S133BFG vs 70T3599S133BFI feature comparison

IDT70T3599S133BFG Integrated Device Technology Inc

Buy Now Datasheet

70T3599S133BFI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA CABGA
Package Description LFBGA, BGA208,17X17,32 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208
Pin Count 208 208
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e1 e0
Length 15 mm 15 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 208
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX36 128KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA208,17X17,32 BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.2 mm
Standby Current-Max 0.015 A 0.02 A
Standby Voltage-Min 2.4 V 2.4 V
Supply Current-Max 0.37 mA 0.45 mA
Supply Voltage-Max (Vsup) 2.6 V 2.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 15 mm 15 mm
Base Number Matches 1 2
Manufacturer Package Code BF208
Memory » SRAMs
Memory » SRAMs

Compare IDT70T3599S133BFG with alternatives

Compare 70T3599S133BFI with alternatives